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High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

Productdetails:
Plaats van herkomst: China
Merknaam: Ziitek
Certificering: UL & RoHS
Modelnummer: TIF500-30-11US
Betalen & Verzenden Algemene voorwaarden:
Min. bestelaantal: 1000 STUKS
Prijs: 0.1-10 USD/PCS
Verpakking Details: 24*13*12cm Kartons
Levertijd: 3-5 werkdagen
Betalingscondities: T/T
Levering vermogen: 1000000 pc's/maand
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Gedetailleerde productomschrijving
Producten Naam: Hoogwaardige 3,0 W/MK siliconen thermische pad met uitstekende geleidbaarheid en isolatie voor CPU, Dikte bereik: 0,25~5,0 mm /(0,010~0,20 inch)
Hardheid: 20 kust 00 Dikte: 3.1 g/cm3
Thermische geleidbaarheid: 3.0W/m-k Kleur: Donkergrijs
Trefwoorden: silicone thermisch stootkussen Sollicitatie: CPU GPU AI en processors

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors

 

Products Description

 

TIF®500-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces,and the susceptibility of precision components to mechanical damage in high-precision assemblies.


Features:

 

> High thermal conductivity
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

> RoHS compliant
> UL recognized


Applications:

 

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Photovoltaic
> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> Display card
> Mainboard/mother board
> Notebook

 

Typical Properties of TIF®500-30-11US Series
Property Value Test method
Color Dark gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.5) (0.75~5.0)
Hardness 65 Shore 00 20 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 6.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 3.0 W/m-K ASTM D5470
3.0 W/m-K ISO22007

 

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors 0

Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"× 16" (406 mm×406 mm)
 
Component Codes:
 
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

High-Performance 3.0W/MK Silicone Thermal Pad With Great Conductivity & Insulation For CPU GPU AI And Processors 1

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

FAQ:

 

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China

 

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.

 

Q: What thermal conductivity test method was used to achieve the values given on the data sheets?

A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.

 

Q: Is GAP PAD offered with an adhesive?

A: Currently, Most of thermal gap pad surface has double side natural inherent tack,Non-stick surface can also be treated according to customer's requirements.

Contactgegevens
Dongguan Ziitek Electronical Material and Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

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