Het Thermische Geleidende Stootkussen ziet eruit en zeer goed werkt. Wij hebben geen behoefte nu aan ander Thermisch Geleidend Stootkussen!
—— Peter Gay
Ik had met Ziitek 2 jaar samengewerkt, verstrekten zij hoogte - adviseren de kwaliteits thermische geleidende materialen, en de levering op tijd, hun materialen van de faseverandering
—— Antonello SAU
Goede kwaliteit, de Goede dienst. Uw team geeft ons altijd hulp en het oplossen, hoop wij de hele tijd goede partner zullen zijn!
Thermal Conductive CPU Thermal Pad With 5.0W/MK Gap Pad Material Suitable For Portable Electronics Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of ... Lees meer
China company supplied and professional CPU thermal pad TIF500-50-11S with grey color for various electronic device Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, ... Lees meer
High performance low cost CPU thermal pad TIF5160US with violet color for various electronic device The TIF5160US is an electrically isolating material, which allows its use in applications requiring isolation ... Lees meer
good performance CPU thermal pad TIF5200US with Violet color for various electronic device The TIF5200US is an electrically isolating material, which allows its use in applications requiring isolation between ... Lees meer
4.5mm mainboard/mother board Applicated Soft thermal conductive gap pad 5.0W/M-K 45shore00 Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Lees meer
5.0mm mainboard/mother board Applicated Soft thermal conductive gap pad 5.0W/M-K 45shore00 Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the ... Lees meer
1.0mmT grey Micro heat pipe thermal solutions applied Thermal Gap Filler Pad 4.0W/MK 20 Shore 00 TIF540-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the ... Lees meer
20 Shore 00 LED Power Supply applied 2.5mmT ultra soft thermal gap pad Pad 4.0W/MK TIF5100-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements ... Lees meer
4.0W/MK 20 Shore 00 Telecommunication hardware applied 3.0mmT ultra soft thermal gap pad TIF5120-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating ... Lees meer
4.0W/mK RoHS compliant, new developed thermally conductive silicone rubber 5.0mmT, 20 Shore 00 for CPU TIF5200-40-11US Series thermally conductive interface materials are applied to fill the air gaps between ... Lees meer