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Thermal Interface Materials High Thermal Conductivity LED Heat Conduction Silicone Pad Thermal Conductive Pads Gap Filler

Thermal Interface Materials High Thermal Conductivity LED Heat Conduction Silicone Pad Thermal Conductive Pads Gap Filler

Productdetails:
Place of Origin: China
Merknaam: Ziitek
Certificering: UL & RoHS
Model Number: TIF500-20-11U
Betalen & Verzenden Algemene voorwaarden:
Minimum Order Quantity: 1000pcs
Prijs: 0.1-10 USD/PCS
Packaging Details: 24*13*12cm cartons
Delivery Time: 3-5 work days
Payment Terms: T/T
Supply Ability: 1000000 pcs/month
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Gedetailleerde productomschrijving
Products name: Thermal Interface Materials High Thermal Conductivity LED Heat Conduction Silicone Pad Thermal Conductive Pads Gap Filler Thermal Conductivity: 2.0 W/mK
Keywords: Thermal Conductive Gap Filler Application: LED Electronic Equipment
Thinkness range: 0.020"(0.5mm)~0.200"(5.00mm) Color: Gray
Flam rating: 94 V-0 Hardness: 27±5 Shore 00
Specific Gravity: 2.7g/cm³

Thermal Interface Materials High Thermal Conductivity LED Heat Conduction Silicone Pad Thermal Conductive Pads Gap Filler

 

Company Profile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

TIF®500-20-11U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB,  which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features:
> Excellent thermal conductivity 2.5W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light

Typical Properties of TIF®500-20-11U Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.7g/cm³ ASTM D792
thickness 0.020"(0.5mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 27±5 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Fire rating 94 V0 UL (E331100)
Thermal conductivity 2.0 W/m-K ASTM D5470

Standard Thicknesses:

 

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

 

Consult the factory to alternate thickness.

 

Product Specification
Product Thicknesses: 0.020"(0.5mm)~0.200"(5.00mm) 
Product Sizes:8" x 16"(203mm x406mm)
Individual die cut shapesand and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.
Thermal Interface Materials High Thermal Conductivity LED Heat Conduction Silicone Pad Thermal Conductive Pads Gap Filler 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

 

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

 

Q: How to find a right thermal conductivity for my applications

A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.

 

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Contactgegevens
Dongguan Ziitek Electronical Material and Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

Direct Stuur uw aanvraag naar ons (0 / 3000)

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