Name: Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler
Brand: Dongguan Ziitek Electronical Material and Technology Ltd.
SKU: TIF500-65-11US
Price: 4.10 USD
Availability: InStock

Thuis Producten heatsink thermisch stootkussen

Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler

Productdetails:

Plaats van herkomst:	China
Merknaam:	Ziitek
Certificering:	UL & RoHS
Modelnummer:	TIF500-65-11US

Betalen & Verzenden Algemene voorwaarden:

Min. bestelaantal:	1000 stuks
Prijs:	0.1-10 USD/PCS
Verpakking Details:	241312cm dozen
Levertijd:	3-5 werkdagen
Betalingscondities:	T/T
Levering vermogen:	1000000 pc's/maand

Contact

Gedetailleerde productomschrijving

Producten Naam:	Zeer efficiënte thermische geleidbaarheid 6,5 W/MK hittebestendige siliconen pad voor laptop koellic	Steekproef:	Monster gratis
Doorslagspanning (V/mm):	≥5500	Dikte bereik:	0,010"~0,200"(0,25mm~5,0mm)
Trefwoorden:	CPU thermische pad	Diëlektrische constante @ 1MHz:	7,0 MHz
Brandclassificatie:	94 v0	Kleur:	Donkergrijs
Thermische geleidbaarheid:	6.5W/m-K	Sollicitatie:	Laptop-koellichaam, CPU, GPU, SSD, IC, LED-koeler

Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

The TIF^®500-65-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness, achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features

> Good thermal conductive
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

Applications

> Routers
> Medical Devices
> Auditioning electronic products
> Unmanned aerial vehicle(UAV)

> Photovoltaic
> Signal communication
> New energy vehicle

> Motherboard chip
> Radiator
> AI Processors AI Servers

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

Typical Properties of TIF^®500-65-11US Series
Property	Value		Test method
Color	Dark Gray		Visual
Construction & Compostion	Ceramic filled silicone elastomer		******
Density(g/cm³)	3.45		ASTM D792
Thickness Range(inch/mm)	0.010~0.020	0.030~0.200	ASTM D374
	(0.25~0.50)	(0.75~5.00)
Hardness	65 Shore 00	20 Shore 00	ASTM 2240
Continuos Use Temp	-40 to 200℃		******
Breakdown Voltage(V/mm)	≥ 5500		ASTM D149
Dielectric Constant	7.0 MHz		ASTM D150
Volume Resistivity	＞1.0X10¹² Ohm-meter		ASTM D257
Thermal Conductivity (W/m-K)	6.5		ASTM D5470
	6.5		ISO22007
Fire rating	V-0		UL 94 (E331100)

Product Specifications
Standard Thickness: 0.010" (0.25 mm)～ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm).

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Highly Efficient Thermal Conductivity 6.5W/MK Heat Resistant Silicone Pad For Laptop Heatsink, CPU, GPU, SSD, IC, LED Cooler 0

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

label:

thermisch interface materieel stootkussen,

de thermische stootkussens van de hitteoverdracht,

thermisch laptop koelstootkussen

Contactgegevens

Dongguan Ziitek Electronical Material and Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

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