PHASE CHANGE MATERIAL TIC800P

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PHASE CHANGE MATERIAL TIC800P

相变化

April 13, 2021

Categorie Verbinding: PCM het materiaal van de faseverandering

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Taggen:

#ga dan het materiaal van de faseverandering langer mee #het thermische stootkussen van de faseverandering #Het thermische Materiaal van de Faseverandering

Brief: Discover the Gray PCM Phase Change Material Thermal Low Melting Point Memory Modules, ideal for high-performance thermal management in electronics. With excellent thermal conductivity and durability, these modules are perfect for microprocessors, memory modules, and more.

Related Product Features:

Lage thermische weerstand van 0,014℃-in²/W voor efficiënte warmteafvoer.
Naturally tacky at room temperature, eliminating the need for adhesives.
No heat sink preheating required, simplifying installation.
Durable performance with no degradation after 1,000 hours at 130℃.
Available in multiple thicknesses: 0.005”, 0.008”, 0.010”, and 0.012”.
Thermal conductivity of 5.0 W/mK for superior heat transfer.
Suitable for a wide temperature range from -25℃ to 125℃.
Vrijstaand en flexibel, zonder versterkingscomponenten.

FAQ's:

What is the phase change softening temperature of the TIC™800G Series?

The TIC™800G Series begins to soften and flow at 50℃ to 60℃, filling microscopic irregularities for reduced thermal resistance.
Can the TIC™800G Series be used without adhesive?

Yes, the material is naturally tacky at room temperature, so no adhesive is required for installation.
What applications are suitable for the TIC™800G Series?

It is ideal for high-frequency microprocessors, notebooks, desktop PCs, memory modules, cache chips, and IGBTs.