TIF050AB-11S

thermische gel
December 30, 2024
Video beschrijving:
Discover the TIF050AB-11S, a two-component silicone thermally conductive gel material gap filler designed for electronics components. This high-performance solution enhances heat dissipation, ensuring efficiency and longevity for your electronic devices. Ideal for notebooks, set-top boxes, and more.
Gerelateerde video's

TIF040AB-12S

thermische gel
December 30, 2024

TIF030AB-05S

thermische gel
December 30, 2024

grijze pcm

相变化
May 20, 2021

grafietplaat TIR600

导热石墨片
May 14, 2021

siliconenschuim-Z-FOAM800

硅胶发泡棉
May 14, 2021

grafietplaat TIR300C

导热石墨片
May 14, 2021

thermisch vet wit 1

导热膏
April 13, 2021